Invention Grant
US08168490B2 Co-packaging approach for power converters based on planar devices, structure and method
失效
基于平面装置的电力转换器的共包装方法，结构和方法
- Patent Title: Co-packaging approach for power converters based on planar devices, structure and method
- Patent Title (中): 基于平面装置的电力转换器的共包装方法，结构和方法
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Application No.: US12470229Application Date: 2009-05-21
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Publication No.: US08168490B2Publication Date: 2012-05-01
- Inventor: Francois Hebert
- Applicant: Francois Hebert
- Applicant Address: US CA Milpitas
- Assignee: Intersil Americas, Inc.
- Current Assignee: Intersil Americas, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Fogg & Powers LLC
- Main IPC: H01L21/8238
- IPC: H01L21/8238
Abstract:
A voltage converter includes an output circuit having a high-side device and a low-side device which can be formed on a single die (a “PowerDie”). The high-side device can include a lateral diffused metal oxide semiconductor (LDMOS) while the low-side device can include a planar vertical diffused metal oxide semiconductor (VDMOS). The voltage converter can further include a controller circuit on a different die which can be electrically coupled to, and co-packaged with, the power die.
Public/Granted literature
- US20100155836A1 CO-PACKAGING APPROACH FOR POWER CONVERTERS BASED ON PLANAR DEVICES, STRUCTURE AND METHOD Public/Granted day:2010-06-24
Information query
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