Disclosed are molded ultra-thin semiconductor die packages, systems that incorporate such packages, and methods of making such packages. An exemplary package comprises a leadframe having an aperture formed between the leadframe's first and second surfaces, and a plurality of leads disposed adjacent to the aperture. The package further comprises a semiconductor disposed in the aperture of the leadframe with its top surface substantially flush with the leadframe's first surface, and at least one gap between at least one side surface of the semiconductor die and at least one lead of the leadframe. A body of electrically insulating material is disposed in the at least one gap. A plurality of conductive members interconnect leads of the leadframe with conductive regions on the die's top surface, with at least one conductive member having a portion disposed over at least a portion of the body of insulating material.