Invention Grant
US08168460B2 Method for manufacturing group III nitride compound semiconductor light-emitting device, group III nitride compound semiconductor light-emitting device, and lamp 有权
制造III族氮化物化合物半导体发光元件,III族氮化物化合物半导体发光元件和灯的方法

  • Patent Title: Method for manufacturing group III nitride compound semiconductor light-emitting device, group III nitride compound semiconductor light-emitting device, and lamp
  • Patent Title (中): 制造III族氮化物化合物半导体发光元件,III族氮化物化合物半导体发光元件和灯的方法
  • Application No.: US12519987
    Application Date: 2007-12-18
  • Publication No.: US08168460B2
    Publication Date: 2012-05-01
  • Inventor: Hisayuki MikiKenzo HanawaYasumasa Sasaki
  • Applicant: Hisayuki MikiKenzo HanawaYasumasa Sasaki
  • Applicant Address: JP Tokyo
  • Assignee: Showa Denko K.K.
  • Current Assignee: Showa Denko K.K.
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2006-343020 20061220
  • International Application: PCT/JP2007/074311 WO 20071218
  • International Announcement: WO2008/075679 WO 20080626
  • Main IPC: H01L21/20
  • IPC: H01L21/20
Method for manufacturing group III nitride compound semiconductor light-emitting device, group III nitride compound semiconductor light-emitting device, and lamp
Abstract:
A method for manufacturing a Group III nitride semiconductor light-emitting device according to the present invention, comprising forming, on a substrate, a semiconductor layer comprised of a Group III nitride compound semiconductor containing Ga as a Group III element by a sputtering method, wherein during the formation of the semiconductor layer, sputtering is performed under the condition where at least the surface layer of a sputtering target comprised of Ga is liquefied.
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