Invention Grant
- Patent Title: Low activation energy photoresist composition and process for its use
- Patent Title (中): 低活化能光刻胶组合物及其使用方法
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Application No.: US12253072Application Date: 2008-10-16
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Publication No.: US08168366B2Publication Date: 2012-05-01
- Inventor: Robert David Allen , Richard Anthony DiPietro , Ratnam Sooriyakumaran , Hoa D Truong
- Applicant: Robert David Allen , Richard Anthony DiPietro , Ratnam Sooriyakumaran , Hoa D Truong
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: CanaanLaw, P.C.
- Agent Karen Canaan
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/30 ; C08F24/00
Abstract:
The present invention relates to a radiation sensitive photoresist composition. The composition comprises a polymer comprising at least two monomers. The first monomer has an acid cleavable tertiary ester group. The second monomer is an acidic monomer. The acid cleavable ester group of the polymer has a surprisingly low activation energy which results in improved resist images in lithographic processes.
Public/Granted literature
- US20110008727A1 Low Activation Energy Photoresist Composition and Process for Its Use Public/Granted day:2011-01-13
Information query
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