Invention Grant
- Patent Title: Film formation method and apparatus for semiconductor process
- Patent Title (中): 用于半导体工艺的成膜方法和装置
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Application No.: US11896752Application Date: 2007-09-05
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Publication No.: US08168270B2Publication Date: 2012-05-01
- Inventor: Kazuhide Hasebe , Yoshihiro Ishida , Takehiko Fujita , Jun Ogawa , Shigeru Nakajima
- Applicant: Kazuhide Hasebe , Yoshihiro Ishida , Takehiko Fujita , Jun Ogawa , Shigeru Nakajima
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2006-242043 20060906
- Main IPC: C23C16/513
- IPC: C23C16/513

Abstract:
An oxide film is formed on a target substrate by CVD, in a process field to be selectively supplied with a first process gas including a source gas containing a film source element and no amino group, a second process gas including an oxidizing gas, and a third process gas including a preliminary treatment gas. A first step includes an excitation period of supplying the third process gas excited by an exciting mechanism, thereby performing a preliminary treatment on the target substrate by preliminary treatment gas radicals. A second step performs supply of the first process gas, thereby adsorbing the film source element on the target substrate. A third step includes an excitation period of supplying the second process gas excited by an exciting mechanism, thereby oxidizing the film source element adsorbed on the target substrate by oxidizing gas radicals.
Public/Granted literature
- US20080107824A1 Film formation method and apparatus for semiconductor process Public/Granted day:2008-05-08
Information query
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