Invention Grant
- Patent Title: Methods for rework of a solder
- Patent Title (中): 焊料返工方法
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Application No.: US13073952Application Date: 2011-03-28
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Publication No.: US08167189B2Publication Date: 2012-05-01
- Inventor: Alfred A. Zinn , Charles Packer , Frances Chiu , Earl Montgomery
- Applicant: Alfred A. Zinn , Charles Packer , Frances Chiu , Earl Montgomery
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: McDermott Will & Emery LLP
- Main IPC: B23K1/018
- IPC: B23K1/018 ; B23K31/02
Abstract:
Methods for reworking a solder containing one or more joined members are described herein. Such methods can include applying a disintegrating agent to a solder containing a solder material, disintegrating the solder material to form a disintegrated solder material, and removing the disintegrated solder material from the solder. Such methods can also include applying a disintegrating agent containing bismuth to a solder containing a solder material, and heating the solder to liquefy the disintegrating agent. Such methods can also include applying a disintegrating agent containing a bismuth alloy to a solder having a solder material that contains metal nanoparticles, and heating the solder to liquefy the bismuth alloy.
Public/Granted literature
- US20110240716A1 METHODS FOR REWORK OF A SOLDER Public/Granted day:2011-10-06
Information query
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