Invention Grant
- Patent Title: Perforator
- Patent Title (中): 穿孔器
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Application No.: US11173535Application Date: 2005-07-01
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Publication No.: US08166857B2Publication Date: 2012-05-01
- Inventor: Wade A. Powell , Scott K. Carter, Jr. , Mark McDonnell
- Applicant: Wade A. Powell , Scott K. Carter, Jr. , Mark McDonnell
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B26F1/24
- IPC: B26F1/24

Abstract:
Various embodiments of a perforator are disclosed.
Public/Granted literature
- US20070000364A1 Perforator Public/Granted day:2007-01-04
Information query
IPC分类: