Invention Grant
- Patent Title: Refrigeration capacity banking for thermal cycling
- Patent Title (中): 制冷能力银行热循环
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Application No.: US12247418Application Date: 2008-10-08
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Publication No.: US08166773B2Publication Date: 2012-05-01
- Inventor: Darin E. Immink , Clinton A. Peterson , Andrew R. Veldt
- Applicant: Darin E. Immink , Clinton A. Peterson , Andrew R. Veldt
- Applicant Address: US WI Pewaukee
- Assignee: Venturedyne, Ltd.
- Current Assignee: Venturedyne, Ltd.
- Current Assignee Address: US WI Pewaukee
- Agency: Michael Best & Friedrich LLP
- Main IPC: F25B13/00
- IPC: F25B13/00

Abstract:
A thermal cycling system includes a structure defining a load space, a heating assembly positioned to heat to the load space, and a cooling assembly positioned to cool the load space. The cooling assembly includes a refrigeration circuit and a banking circuit. The refrigeration circuit has a compressor, a refrigeration condenser, a first refrigeration evaporator in direct thermal communication with the load space, a second refrigeration evaporator in parallel with the first evaporator, and primary refrigerant circulating throughout the refrigeration circuit. The banking circuit is gravity fed and includes a banking condenser, a banking evaporator positioned to cool the load space, and a banking refrigerant circulating throughout the banking circuit. The banking condenser includes a collection reservoir to store liquid banking refrigerant and is in thermal communication with the second refrigeration evaporator.
Public/Granted literature
- US20100083691A1 REFRIGERATION CAPACITY BANKING FOR THERMAL CYCLING Public/Granted day:2010-04-08
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