Invention Grant
- Patent Title: Semiconductor device capable of being tested after packaging
- Patent Title (中): 能够在包装后进行测试的半导体装置
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Application No.: US12698672Application Date: 2010-02-02
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Publication No.: US08149637B2Publication Date: 2012-04-03
- Inventor: Hee-Il Hong , Kang-Young Cho
- Applicant: Hee-Il Hong , Kang-Young Cho
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F Chau & Associates, LLC
- Priority: KR10-2009-0044133 20090520
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C29/00

Abstract:
Provided is a semiconductor device capable of effectively testing whether memory cells and a memory cell array are defective. The semiconductor device may include a memory cell array having a plurality of memory cells and an external test pad connected to an internal test pad. A test voltage may be applied to the plurality of word lines connected to the plurality of memory cells via the external test pad and the internal test pad in a test mode, wherein the test voltage disables the plurality of word lines.
Public/Granted literature
- US20100296353A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-11-25
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