An electromagnetic shield structure of an electronics housing includes a terminal having a protrusion for external connection; a substrate having the terminal disposed thereon and electrically connected to the terminal; a housing made of resin, enclosing the substrate and having an opening at a position corresponding to the protrusion of the terminal on a front surface side where the protrusion of the terminal is located; and an electromagnetic shield disposed so as to surround the substrate inside the housing, having an opening at the position corresponding to the protrusion of the terminal, and electromagnetically shielding the substrate. The electromagnetic shield has a bent portion formed on the front surface side for filling a gap between the terminal and the housing.