A wiring connecting structure for a piezoelectric element is capable of performing wiring to the piezoelectric element without deteriorating the quality and reliability of the piezoelectric element. The piezoelectric element is arranged between a base and head of an object, to minutely move the head in a sway direction according to deformation that occurs on the piezoelectric element in response to a voltage applied from a terminal to an electrode of the piezoelectric element. The wiring connecting structure includes first and second liquid stoppers arranged between the terminal and the electrode, the second liquid stopper being arranged outside the first liquid stopper. The wiring connecting structure also includes an adhesive part to connect the electrode to the terminal. The adhesive part has a conductive adhesive part defined by the first liquid stopper and a sealing adhesive part defined by the second liquid stopper. The sealing adhesive part seals the first liquid stopper and conductive adhesive part.