Invention Grant
- Patent Title: Forming compliant contact pads for semiconductor packages
- Patent Title (中): 形成用于半导体封装的兼容接触焊盘
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Application No.: US13075345Application Date: 2011-03-30
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Publication No.: US08148805B2Publication Date: 2012-04-03
- Inventor: Qing Zhou , Wei Shi , Daoqiang Lu , Jiangqi He
- Applicant: Qing Zhou , Wei Shi , Daoqiang Lu , Jiangqi He
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L21/44 ; H01L21/31
Abstract:
In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes compliant conductive pads to provide electrical connections to the semiconductor die. In this way, improved connection between the semiconductor package and a socket is provided. Other embodiments are described and claimed.
Public/Granted literature
- US20110175230A1 Forming Compliant Contact Pads for Semiconductor Packages Public/Granted day:2011-07-21
Information query
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