Invention Grant
- Patent Title: Anisotropic conductive material, connected structure, and production method thereof
- Patent Title (中): 各向异性导电材料，连接结构及其制造方法
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Application No.: US12451501Application Date: 2008-04-15
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Publication No.: US08148641B2Publication Date: 2012-04-03
- Inventor: Yoshito Tanaka , Jun Yamamoto
- Applicant: Yoshito Tanaka , Jun Yamamoto
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-167479 20070626; JP2008-037781 20080219
- International Application: PCT/JP2008/057317 WO 20080415
- International Announcement: WO2009/001605 WO 20081231
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
An anisotropic conductive material prevents conduction resistance from varying among bumps or among linear terminals when connecting an IC chip or a flexible wire to a wiring board via the anisotropic conductive material. The anisotropic conductive material is formed by dispersing conductive particles in an insulating binder. The minimum melt viscosity [η0] thereof is in a range of from 1×102 to 1×106 mPa·sec, and satisfies the following equation (1): 1
Public/Granted literature
- US20100103630A1 ANISOTROPIC CONDUCTIVE MATERIAL, CONNECTED STRUCTURE, AND PRODUCTION METHOD THEREOF Public/Granted day:2010-04-29
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