Invention Grant
- Patent Title: Housing for an electronic apparatus
- Patent Title (中): 电子仪器的外壳
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Application No.: US12232628Application Date: 2008-09-22
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Publication No.: US08148633B2Publication Date: 2012-04-03
- Inventor: Kuang-Hui Hung
- Applicant: Kuang-Hui Hung
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corporation
- Current Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corporation
- Current Assignee Address: CN Guangzhou TW Taipei
- Agency: Li&Cai Intellectual Property (USA) Office
- Priority: CN200710033040 20071228
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
A housing for an electronic apparatus includes a first cover having at least one wedging hook, a second cover having at least one wedging structure that matches at the least one wedging hook, and a third cover having at least one convex block. The convex block of the third cover extends into the wedging structure of the second cover to lock with the wedging hook of the first cover with the wedging structure. The housing can be applied to a cell phone, PDA and other electronic apparatus.
Public/Granted literature
- US20090168311A1 Housing for an electronic apparatus Public/Granted day:2009-07-02
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