Invention Grant
- Patent Title: Drum pad and manufacturing method thereof
- Patent Title (中): 鼓垫及其制造方法
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Application No.: US12776299Application Date: 2010-05-07
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Publication No.: US08148617B2Publication Date: 2012-04-03
- Inventor: Ryuji Hashimoto , Shuichi Sawada , Kenichi Nishida , Keizo Harada
- Applicant: Ryuji Hashimoto , Shuichi Sawada , Kenichi Nishida , Keizo Harada
- Applicant Address: JP Hamamatsu-shi
- Assignee: Yamaha Corporation
- Current Assignee: Yamaha Corporation
- Current Assignee Address: JP Hamamatsu-shi
- Agency: Morrison & Foerster LLP
- Priority: JP2009-113499 20090508; JP2009-113501 20090508; JP2009-172901 20090724
- Main IPC: G10D13/02
- IPC: G10D13/02
Abstract:
A drum pad capable of providing an excellent percussion feeling and securely adhering a base portion to a body portion made of rubber. The drum pad has a rear-side clothlike material which is provided on a rear surface of the body portion and into which the rubber of the body portion is impregnated. The base portion is fixed to a rear surface of the rear-side clothlike material via a fixing layer made of pressure sensitive adhesive or adhesive and provided on the rear surface of the rear-side clothlike material.
Public/Granted literature
- US20100282048A1 Drum Pad and Manufacturing Method Thereof Public/Granted day:2010-11-11
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