Invention Grant
- Patent Title: Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base plate sensor
- Patent Title (中): 降低轧制基板的弯曲变形的方法和具有这种基板传感器的半导体模块
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Application No.: US11536357Application Date: 2006-09-28
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Publication No.: US08148198B2Publication Date: 2012-04-03
- Inventor: Georg Borghoff , Thomas Nuebel , Reinhold Spanke , Martin Woelz
- Applicant: Georg Borghoff , Thomas Nuebel , Reinhold Spanke , Martin Woelz
- Applicant Address: DE Meubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Meubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102005046404 20050928
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled in their longitudinal direction in a specific manner.
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