Invention Grant
- Patent Title: Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive.
- Patent Title (中): 穿孔多孔树脂基材和多孔树脂基底的生产过程,其内壁表面的穿孔导电。
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Application No.: US10559580Application Date: 2004-06-04
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Publication No.: US08147911B2Publication Date: 2012-04-03
- Inventor: Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga , Taro Fujita , Mayo Uenoyama , Yasuhito Masuda , Yuichi Idomoto
- Applicant: Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga , Taro Fujita , Mayo Uenoyama , Yasuhito Masuda , Yuichi Idomoto
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2003-161635 20030606; JP2003-275443 20030716
- International Application: PCT/JP2004/008145 WO 20040604
- International Announcement: WO2004/108332 WO 20041216
- Main IPC: B05D1/32
- IPC: B05D1/32 ; B05D3/00 ; B05D5/00 ; H01K3/10

Abstract:
A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.
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