An apparatus for depositing and separating excess copper dissolved in molten lead-free solder containing tin as the main element is provided. An apparatus 1 deposits excess copper in the molten lead-free solder as an intermetallic compound and separates it from the molten solder. The apparatus includes a deposition bath 2 for causing an intermetallic compound in the molten solder, a metal added from the outside and copper in the molten solder to be deposited, a granulation bath 4 including plates 31 32 and 33 for allowing the molten solder to pass through the plates to merge the intermetallic compounds into particles having a larger diameter, and a separation bath 5 for causing the enlarged intermetallic compounds to precipitate and separate in the molten solder.