Invention Grant
- Patent Title: Method for manufacturing gallium nitride crystal and gallium nitride wafer
- Patent Title (中): 制造氮化镓晶体和氮化镓晶片的方法
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Application No.: US12298332Application Date: 2007-04-24
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Publication No.: US08147612B2Publication Date: 2012-04-03
- Inventor: Tomoki Uemura , Takashi Sakurada , Shinsuke Fujiwara , Takuji Okahisa , Koji Uematsu , Hideaki Nakahata
- Applicant: Tomoki Uemura , Takashi Sakurada , Shinsuke Fujiwara , Takuji Okahisa , Koji Uematsu , Hideaki Nakahata
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2006-126039 20060428
- International Application: PCT/JP2007/058843 WO 20070424
- International Announcement: WO2007/125914 WO 20071108
- Main IPC: C30B21/02
- IPC: C30B21/02

Abstract:
There is provided a method for fabricating a gallium nitride crystal with low dislocation density, high crystallinity, and resistance to cracking during polishing of sliced pieces by growing the gallium nitride crystal using a gallium nitride substrate including dislocation-concentrated regions or inverted-polarity regions as a seed crystal substrate. Growing a gallium nitride crystal 79 at a growth temperature higher than 1,100° C. and equal to or lower than 1,300° C. so as to bury dislocation-concentrated regions or inverted-polarity regions 17a reduces dislocations inherited from the dislocation-concentrated regions or inverted regions 17a, thus preventing new dislocations from occurring over the dislocation-concentrated regions or inverted-polarity regions 17a. This also increases the crystallinity of the gallium nitride crystal 79 and its resistance to cracking during the polishing.
Public/Granted literature
- US20090194848A1 METHOD FOR MANUFACTURING GALLIUM NITRIDE CRYSTAL AND GALLIUM NITRIDE WAFER Public/Granted day:2009-08-06
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