Invention Grant
- Patent Title: Composite electroless plating
- Patent Title (中): 复合无电镀
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Application No.: US12962034Application Date: 2010-12-07
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Publication No.: US08147601B2Publication Date: 2012-04-03
- Inventor: Michael Feldstein , Thomas Stephen Lancsek , Jijeesh Jose Thottathil
- Applicant: Michael Feldstein , Thomas Stephen Lancsek , Jijeesh Jose Thottathil
- Applicant Address: US NJ Robbinsville
- Assignee: Surface Technology, Inc.
- Current Assignee: Surface Technology, Inc.
- Current Assignee Address: US NJ Robbinsville
- Agency: Gottlieb Rackman & Reisman,PC
- Main IPC: C23C18/31
- IPC: C23C18/31 ; C23C18/34 ; C23C18/40
Abstract:
This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals.
Public/Granted literature
- US20110077338A1 COMPOSITE ELECTROLESS PLATING WITH PTFE Public/Granted day:2011-03-31
Information query
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