Invention Grant
- Patent Title: Percutaneous spinal implants and methods
- Patent Title (中): 经皮脊髓植入物和方法
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Application No.: US11927824Application Date: 2007-10-30
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Publication No.: US08147516B2Publication Date: 2012-04-03
- Inventor: Hugues F. Malandain , Avram Allan Edidin , Robert Alexander Vandervelde
- Applicant: Hugues F. Malandain , Avram Allan Edidin , Robert Alexander Vandervelde
- Applicant Address: CH Neuchatel
- Assignee: Kyphon Sarl
- Current Assignee: Kyphon Sarl
- Current Assignee Address: CH Neuchatel
- Main IPC: A61F2/44
- IPC: A61F2/44
Abstract:
A method includes positioning a medical device within a body between adjacent spinous processes, moving the medical device from a collapsed configuration to an expanded configuration within the body using an actuator removably coupled to the medical device, and removing the actuator from the body while the medical device remains between the adjacent spinous processes.
Public/Granted literature
- US20080051891A1 PERCUTANEOUS SPINAL IMPLANTS AND METHODS Public/Granted day:2008-02-28
Information query
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