A cooling module for use with a DMD module of a projection apparatus is provided. The cooling module includes a heat conduction device, at least one heat pipe, and at least one fin. Heat accumulating on the DMD module can be released from the heat conduction device to the fins through the heat pipe. Meanwhile, the fins partially overlap along the direction of the light coming from the light source. Thus, the fins can also prevent the unused light in the casing of the projection apparatus from leakage.