Invention Grant
- Patent Title: Back pressure adjustment apparatus for liquid ejection head
- Patent Title (中): 用于液体喷头的背压调节装置
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Application No.: US12045975Application Date: 2008-03-11
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Publication No.: US08147043B2Publication Date: 2012-04-03
- Inventor: Toshiya Kojima , Yasuhiko Kachi , Masahito Katada
- Applicant: Toshiya Kojima , Yasuhiko Kachi , Masahito Katada
- Applicant Address: JP Tokyo
- Assignee: Fujifilm Corporation
- Current Assignee: Fujifilm Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-075251 20070322
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
The back pressure adjustment apparatus for a liquid ejection head has: a container having a liquid accommodating chamber which is connected to the liquid ejection head and accommodates liquid to be supplied to the liquid ejection head, and a gas accommodating chamber which accommodates gas; a movable film which separates the liquid accommodating chamber and the gas accommodating chamber, and forms a portion of whole walls of the liquid accommodating chamber; and a pressure adjustment device which causes all or a portion of the movable film to deform so as to adjust pressure of the liquid accommodated in the liquid accommodating chamber.
Public/Granted literature
- US20080231650A1 BACK PRESSURE ADJUSTMENT APPARATUS FOR LIQUID EJECTION HEAD Public/Granted day:2008-09-25
Information query
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