A pick-and-place module for test handlers includes a main body, and a kit. The main body has N-th vacuum paths (where N is plural). The kit has M-th pickers. The M-th pickers are provided so as respectively correspond to M-th vacuum passages (where 1≦M≦N), which are formed to respectively correspond to all or some of the N-th vacuum paths formed in the main body, and holds semiconductor devices or releasing the held semiconductor devices using vacuum pressures. The kit is detachably mounted to the main body.