Invention Grant
US08136074B2 Printed circuit board design support program, recording medium, and printed circuit board design support method 有权
印刷电路板设计支持程序,记录介质和印刷电路板设计支持方法

Printed circuit board design support program, recording medium, and printed circuit board design support method
Abstract:
To automatically arrange vias on a printed circuit board so as to satisfy a predetermined condition. A printed circuit board design support method for causing a computer to execute a ground conductive area identifying conductive areas which can be used as grounds of a printed circuit board having a plurality of conductive layers, an extracting an overlapping conductive area in which the conductive areas identified in the ground conductive area identifying are two-dimensionally overlapped with one another, and an automatic arranging interlayer connection members configured to electrically connect at least two layers with one another among the plurality of conductive areas in the overlapping conductive area extracted in the extracting at an interval within a predetermined distance.
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