Invention Grant
US08136074B2 Printed circuit board design support program, recording medium, and printed circuit board design support method
有权
印刷电路板设计支持程序,记录介质和印刷电路板设计支持方法
- Patent Title: Printed circuit board design support program, recording medium, and printed circuit board design support method
- Patent Title (中): 印刷电路板设计支持程序,记录介质和印刷电路板设计支持方法
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Application No.: US12499733Application Date: 2009-07-08
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Publication No.: US08136074B2Publication Date: 2012-03-13
- Inventor: Toshisato Sadamatsu
- Applicant: Toshisato Sadamatsu
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JP2008-182043 20080711
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
To automatically arrange vias on a printed circuit board so as to satisfy a predetermined condition. A printed circuit board design support method for causing a computer to execute a ground conductive area identifying conductive areas which can be used as grounds of a printed circuit board having a plurality of conductive layers, an extracting an overlapping conductive area in which the conductive areas identified in the ground conductive area identifying are two-dimensionally overlapped with one another, and an automatic arranging interlayer connection members configured to electrically connect at least two layers with one another among the plurality of conductive areas in the overlapping conductive area extracted in the extracting at an interval within a predetermined distance.
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