Invention Grant
- Patent Title: Integrated circuit and assembly therewith
- Patent Title (中): 集成电路和组装
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Application No.: US13030695Application Date: 2011-02-18
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Publication No.: US08134815B2Publication Date: 2012-03-13
- Inventor: Johannes F. Dijkhuis , Antonius J. M. De Graauw
- Applicant: Johannes F. Dijkhuis , Antonius J. M. De Graauw
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP06115750 20060620
- Main IPC: H02H9/00
- IPC: H02H9/00 ; H02H7/12 ; H02H1/00 ; H02H1/04 ; H02H3/22 ; H02H9/06

Abstract:
An integrated circuit suitable for use at high frequencies and comprising a first capacitor having an input and an output, as well as a ground connection, wherein the capacitor is ESD-protected through an resistor between the capacitor output and the ground connection, which resistor has a resistance value that is sufficiently high so as to prevent any substantial influence on RF performance of the ground connection.
Public/Granted literature
- US20110141639A1 Integrated Circuit and Assembly Therewith Public/Granted day:2011-06-16
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