A semiconductor wafer includes a plurality of integrated circuit (IC) die areas for accommodating IC die that include at least a first subcircuit having at least one matched component portion that includes at least two matched devices. The first subcircuit is arranged in a layout on the IC die. A plurality of scribe line areas having a scribe line width dimension are interposed between the plurality of IC die areas. At least one subcircuit-based test module (TM) is positioned within the scribe line areas, wherein the subcircuit-based TMs implement a schematic for the first subcircuit with a TM layout that copies the layout on the IC die for at least the two matched devices in the matched component portion and alters the layout on the IC die for a portion of the first subcircuit other than the matched devices in matched component portion to fit the TM layout of the first subcircuit within the scribe line width dimension.