Invention Grant
- Patent Title: Integrated circuit package system with concave terminal
- Patent Title (中): 集成电路封装系统带凹端
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Application No.: US12185616Application Date: 2008-08-04
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Publication No.: US08134242B2Publication Date: 2012-03-13
- Inventor: Zigmund Ramirez Camacho , Arnel Senosa Trasporto , Reza Argenty Pagaila , Lionel Chien Hui Tay
- Applicant: Zigmund Ramirez Camacho , Arnel Senosa Trasporto , Reza Argenty Pagaila , Lionel Chien Hui Tay
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
An integrated circuit package system includes: connecting a concave terminal and an integrated circuit; and forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation.
Public/Granted literature
- US20100029046A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONCAVE TERMINAL Public/Granted day:2010-02-04
Information query
IPC分类:
