Invention Grant
- Patent Title: Busbar pack
- Patent Title (中): 母线包
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Application No.: US12518567Application Date: 2007-10-19
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Publication No.: US08134070B2Publication Date: 2012-03-13
- Inventor: Thomas Hirschfeld
- Applicant: Thomas Hirschfeld
- Applicant Address: DE München
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE München
- Agent Henry M. Feiereisen; Ursula B. Day
- Priority: DE102006058327 20061211
- International Application: PCT/EP2007/061195 WO 20071019
- International Announcement: WO2008/071493 WO 20080619
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H02B1/20

Abstract:
The invention relates to a busbar pack comprising n busbars (2) and at least n−1 insulating bars (4) the surfaces of which project beyond the busbars (2), one insulating bar (4) being interposed between two busbars (2), said stack of bars (2, 4) being immobilized in their position relative each other by devices. The invention is characterized in that at least one inner busbar (2) is provided with a reticular bar (6) on both sides thereof and has perforations (14) that are arranged to match crossbars (12) of corresponding reticular bars (6). The invention allows production of a busbar pack at least the inner busbar (2) of which is convection-cooled, said busbar cooling system being producible at low costs.
Public/Granted literature
- US20100025105A1 BUSBAR PACK Public/Granted day:2010-02-04
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