Invention Grant
- Patent Title: Motherboard and power supply module thereof
- Patent Title (中): 主板及其电源模块
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Application No.: US12135216Application Date: 2008-06-09
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Publication No.: US08132028B2Publication Date: 2012-03-06
- Inventor: Jiang-Shin Wu , En-Li Chen
- Applicant: Jiang-Shin Wu , En-Li Chen
- Applicant Address: TW Taipei
- Assignee: ASUSTeK Computer Inc.
- Current Assignee: ASUSTeK Computer Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW96124872A 20070709
- Main IPC: G06F1/00
- IPC: G06F1/00

Abstract:
A motherboard and a power supply module thereof are disclosed. The power supply module provided by the invention can be directly fixed on a motherboard supporting an AM2 CPU and an AM2+ CPU. The power supply module provided by the invention utilizes a switching unit to switch between a group of pulse width modulation (PWM) signals for generating core voltages needed by an AM2 CPU and another PWM signal for generating a core voltage needed by an AM2+ CPU according to a version signal provided by the CPU of the motherboard. Therefore, no matter a CPU socket of the motherboard receives the AM2 CPU or the AM2+ CPU, the power supply module of the invention can obtain the maximum usage efficiency thereof, and the manufacture cost of motherboard with the power supply module decreases.
Public/Granted literature
- US20090019295A1 MOTHERBOARD AND POWER SUPPLY MODULE THEREOF Public/Granted day:2009-01-15
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