Invention Grant
- Patent Title: Fast 4D segmentation of large datasets using graph cuts
- Patent Title (中): 使用图形切割快速4D分割大型数据集
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Application No.: US11927777Application Date: 2007-10-30
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Publication No.: US08131075B2Publication Date: 2012-03-06
- Inventor: Yiyong Sun , Herve Jun Alfred Lombaert , Farida Cheriet
- Applicant: Yiyong Sun , Herve Jun Alfred Lombaert , Farida Cheriet
- Applicant Address: DE München
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE München
- Agency: F. Chau & Associates, LLC
- Agent Donald B. Paschburg
- Main IPC: G06K9/34
- IPC: G06K9/34

Abstract:
A method for segmenting at least a pair of regions of an image. High resolution data is obtained of the image. Each one of the pair of the regions in the image is marked. Graph cuts are used on the downsampled data to obtain first voxels along an outer boundary of a selected one of the pair of marked regions and second voxels along an inner boundary the selected region. The graphs cuts are projected to the previously obtained high-resolution image data. First and second sets of seeds are placed on the first voxels and a second set of seeds respectively. The first seeds grow into first areas extending inwardly of the selected region while simultaneously the second seeds grow into second areas extending towards the first extending areas until the first areas and the second areas meet to thereby establish the outer boundary of the selected region.
Public/Granted literature
- US20080240564A1 Fast 4D Segmentation of Large Datasets Using Graph Cuts Public/Granted day:2008-10-02
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