Invention Grant
- Patent Title: Composite semiconductor device, print head and image forming apparatus
- Patent Title (中): 复合半导体器件，打印头和成像设备
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Application No.: US12457019Application Date: 2009-05-29
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Publication No.: US08130253B2Publication Date: 2012-03-06
- Inventor: Kazuya Ohkawa , Shinya Jyumonji , Masumi Taninaka , Hiroshi Hamano , Masumi Koizumi
- Applicant: Kazuya Ohkawa , Shinya Jyumonji , Masumi Taninaka , Hiroshi Hamano , Masumi Koizumi
- Applicant Address: JP Tokyo
- Assignee: Oki Data Corporation
- Current Assignee: Oki Data Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, PC
- Priority: JP2008-171008 20080630
- Main IPC: B41J2/45
- IPC: B41J2/45 ; H01L21/00
Abstract:
A composite semiconductor device is formed of a semiconductor wafer having a plurality of device-forming areas in which semiconductor elements are formed and dicing areas defined between the device-forming areas, and is formed by dicing the semiconductor wafer at the dicing areas. The composite semiconductor device includes a semiconductor substrate, and a plurality of wiring layers layered on the semiconductor substrate. The wiring layers include at least conductive films. Connecting portions are formed to connect the wiring layers with each other in a layering direction of the wiring layers. Each of the connecting portions is disposed on the device-forming area side with respect to a dicing position defined in the dicing area.
Public/Granted literature
- US20090322852A1 Composite semiconductor device, print head and image forming apparatus Public/Granted day:2009-12-31
Information query
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