Invention Grant
- Patent Title: Gate-all-around integrated circuit devices
- Patent Title (中): 全能集成电路器件
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Application No.: US11374644Application Date: 2006-03-13
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Publication No.: US08129800B2Publication Date: 2012-03-06
- Inventor: Eun-jung Yun , Sung-young Lee , Min-sang Kim , Sung-min Kim
- Applicant: Eun-jung Yun , Sung-young Lee , Min-sang Kim , Sung-min Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec
- Priority: KR10-2005-0079958 20050830
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
Gate-all-around integrated circuit devices include first and second source/drain regions on an active area of an integrated circuit substrate. The first and second source/drain regions form p-n rectifying junctions with the active area. A channel region extends between the first and second source/drain regions. An insulated gate electrode surrounds the channel region.
Public/Granted literature
- US20070045725A1 Gate-all-around integrated circuit devices Public/Granted day:2007-03-01
Information query
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