Invention Grant
US08129751B2 Integrated circuit including at least six linear-shaped conductive structures forming gate electrodes and including four conductive contacting structures having at least two different connection distances
有权
集成电路包括形成栅电极的至少六个线性形状的导电结构,并且包括具有至少两个不同连接距离的四个导电接触结构
- Patent Title: Integrated circuit including at least six linear-shaped conductive structures forming gate electrodes and including four conductive contacting structures having at least two different connection distances
- Patent Title (中): 集成电路包括形成栅电极的至少六个线性形状的导电结构,并且包括具有至少两个不同连接距离的四个导电接触结构
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Application No.: US12567555Application Date: 2009-09-25
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Publication No.: US08129751B2Publication Date: 2012-03-06
- Inventor: Scott T. Becker , Michael C. Smayling
- Applicant: Scott T. Becker , Michael C. Smayling
- Applicant Address: US CA Los Gatos
- Assignee: Tela Innovations, Inc.
- Current Assignee: Tela Innovations, Inc.
- Current Assignee Address: US CA Los Gatos
- Agency: Martine Penilla Group, LLP
- Main IPC: H01L27/10
- IPC: H01L27/10

Abstract:
A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein in a non-symmetrical manner relative to a virtual line defined to bisect the substrate portion. The semiconductor device includes a gate electrode level region including a number of conductive features defined to extend in only a first parallel direction. Adjacent ones of the conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features separated by an end-to-end spacing having a size that is substantially equal across the gate electrode level region and is minimized to an extent allowed by a semiconductor device manufacturing capability. Conductive features are defined along at least four different virtual lines of extent in the first parallel direction. A width of the conductive features is less than a wavelength of light used in a photolithography process for their fabrication.
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