Invention Grant
- Patent Title: Porous substrate plates and the use thereof
- Patent Title (中): 多孔基板及其用途
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Application No.: US12854588Application Date: 2010-08-11
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Publication No.: US08129198B2Publication Date: 2012-03-06
- Inventor: Ye Fang , Ann M. Ferrie , Yulong Hong , Brian L. Webb
- Applicant: Ye Fang , Ann M. Ferrie , Yulong Hong , Brian L. Webb
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent John L. Haack
- Main IPC: G01N33/543
- IPC: G01N33/543

Abstract:
A substrate plate or device adapted for use with biological or chemical assays is disclosed. The device may take the form of a multi-well plate having a three-dimensional, porous layer as part of a support surface within each well for immobilizing probe species. The porous layer is characterized as having a plurality of interconnected voids defined by a matrix of contiguous solid material. A method and its variants are also described.
Public/Granted literature
- US20100323915A1 Porous Substrate Plates And The Use Thereof Public/Granted day:2010-12-23
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