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US08129101B2 Method for increasing the removal rate of photoresist layer 有权
提高光致抗蚀剂层去除率的方法

Method for increasing the removal rate of photoresist layer
Abstract:
A method for increasing the removal rate of a photoresist layer is provided. The method includes performing a pre-treatment of a substrate, such as a plasma process, before forming the photoresist layer. The method can be applied to the fabrication of semiconductor devices for increasing the removal rate of the photoresist layer.
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