Invention Grant
- Patent Title: Method for increasing the removal rate of photoresist layer
- Patent Title (中): 提高光致抗蚀剂层去除率的方法
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Application No.: US12399019Application Date: 2009-03-06
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Publication No.: US08129101B2Publication Date: 2012-03-06
- Inventor: Wen-Hsien Huang , Min-Chieh Yang , Jiunn-Hsing Liao
- Applicant: Wen-Hsien Huang , Min-Chieh Yang , Jiunn-Hsing Liao
- Agent Chun-Ming Shih
- Main IPC: G03F7/26
- IPC: G03F7/26

Abstract:
A method for increasing the removal rate of a photoresist layer is provided. The method includes performing a pre-treatment of a substrate, such as a plasma process, before forming the photoresist layer. The method can be applied to the fabrication of semiconductor devices for increasing the removal rate of the photoresist layer.
Public/Granted literature
- US20090169767A1 METHOD FOR INCREASING THE REMOVAL RATE OF PHOTORESIST LAYER Public/Granted day:2009-07-02
Information query
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