Invention Grant
- Patent Title: Honeycomb segment-forming die and method for manufacturing honeycomb structure
- Patent Title (中): 蜂窝段成型模具及蜂窝结构制造方法
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Application No.: US12617408Application Date: 2009-11-12
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Publication No.: US08128395B2Publication Date: 2012-03-06
- Inventor: Hiroyuki Shindo , Tomoki Nagae
- Applicant: Hiroyuki Shindo , Tomoki Nagae
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-132629 20070518
- Main IPC: B29C47/12
- IPC: B29C47/12

Abstract:
A honeycomb segment-forming die includes: an introducing portion provided on an introduction face side and having a plurality of back holes, and a forming portion provided on an formation face side and having slits communicating with the back holes. The forming portion has a polygonal outer peripheral shape and forms a prismatic honeycomb segment by passing kneaded clay for forming which is introduced from the back holes of the introducing portion through the slits of the forming portion, and a gap between slits formed in each of corner portions including a vertex of the polygonal forming portion is larger than a gap of slits formed in the central portion of the forming portion. This enables to form a honeycomb segment having high compressive strength.
Public/Granted literature
- US20100116427A1 HONEYCOMB SEGMENT-FORMING DIE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE Public/Granted day:2010-05-13
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