Invention Grant
- Patent Title: Method of making bondable flexible printed circuit
- Patent Title (中): 制造可粘合柔性印刷电路的方法
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Application No.: US11897077Application Date: 2007-08-29
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Publication No.: US08127440B2Publication Date: 2012-03-06
- Inventor: Joel S. Douglas
- Applicant: Joel S. Douglas
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/10
Abstract:
A method for producing a circuit assembly having a non-conductive substrate upon which printed conductors may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.
Public/Granted literature
- US20080086876A1 Bondable conductive ink Public/Granted day:2008-04-17
Information query
