Invention Grant
- Patent Title: Integrated circuit with intra-chip and extra-chip RF communication
- Patent Title (中): 具有片内和片外RF通信的集成电路
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Application No.: US12210415Application Date: 2008-09-15
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Publication No.: US08121541B2Publication Date: 2012-02-21
- Inventor: Ahmadreza Reza Rofougaran
- Applicant: Ahmadreza Reza Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick Harrison & Markison
- Agent Bruce E. Stuckman
- Main IPC: H04B5/00
- IPC: H04B5/00

Abstract:
An integrated circuit includes a first integrated circuit die having a first circuit and a first intra-chip interface and a second integrated circuit die having a second circuit and a second intra-chip interface and a remote interface, wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate first signals between the first circuit and the second circuit, and wherein the remote interface is coupled to engage in electromagnetic communications with a remote device. In an embodiment of the present invention, a shielding element shields the electromagnetic communications with the remote device from the electromagnetic communication of the first signals. In other embodiments, antenna beam patterns or differing polarizations are used to isolate the electromagnetic communications with the remote device from the electromagnetic communication of the first signals.
Public/Granted literature
- US20090008753A1 INTEGRATED CIRCUIT WITH INTRA-CHIP AND EXTRA-CHIP RF COMMUNICATION Public/Granted day:2009-01-08
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