Invention Grant
- Patent Title: Method and its apparatus for reviewing defects
- Patent Title (中): 检查缺陷的方法及其设备
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Application No.: US12416273Application Date: 2009-04-01
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Publication No.: US08121397B2Publication Date: 2012-02-21
- Inventor: Minoru Harada , Ryo Nakagaki , Kenji Obara
- Applicant: Minoru Harada , Ryo Nakagaki , Kenji Obara
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-095657 20080402
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method for reviewing a defect on a sample involves the steps of imaging a defect image containing the defect in first magnification by using an image acquisition unit, synthesizing a reference image not containing the defect from the defect image, comparing the defect image acquired with the reference image synthesized to detect a defect applicant, executing a processing for classifying the defect applicant into a defect and a normal portion and imaging only the portion identified as the detect in second magnification. The method makes it possible to specify a defect position without error from the image taken in the first magnification and to image the defect in the second magnification when a large number of defects are observed within a short time by using the image acquisition unit.
Public/Granted literature
- US20090252403A1 METHOD AND ITS APPARATUS FOR REVIEWING DEFECTS Public/Granted day:2009-10-08
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