Invention Grant
- Patent Title: Middle spring supported micro-electro-mechanical transducers
- Patent Title (中): 中弹簧支持微机电换能器
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Application No.: US11914608Application Date: 2006-05-18
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Publication No.: US08120229B2Publication Date: 2012-02-21
- Inventor: Yongli Huang
- Applicant: Yongli Huang
- Applicant Address: US CA San Jose
- Assignee: Kolo Technologies, Inc.
- Current Assignee: Kolo Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lee & Hayes, PLLC
- International Application: PCT/IB2006/051569 WO 20060518
- International Announcement: WO2006/123301 WO 20061123
- Main IPC: H02N1/00
- IPC: H02N1/00 ; A61B8/00 ; H04R19/00

Abstract:
A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a substrate, a top plate, and a middle spring layer therebetween. The substrate and the middle spring layer define cavities therebetween sidewalled by standing features. The middle spring layer is anchored by the standing features to create cantilevers over the cavities to enable a vertical displacement of connectors placed on the middle spring layer. The connectors define a transducing space between the middle spring layer and the top plate. The top plate is transported by the vertical displacement of the connectors in a piston-like motion to change the transducing space and to effectuate energy transformation. Various configurations of cantilevers, including single cantilevers, back-to-back double cantilevers and head-to-head double cantilevers (bridges) are possible.
Public/Granted literature
- US20080197751A1 Micro-Electro-Mechanical Transducers Public/Granted day:2008-08-21
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