Invention Grant
- Patent Title: Integrated circuit package system
- Patent Title (中): 集成电路封装系统
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Application No.: US11307128Application Date: 2006-01-24
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Publication No.: US08120149B2Publication Date: 2012-02-21
- Inventor: Zigmund Ramirez Camacho , Henry D. Bathan , Arnel Trasporto , Jeffrey D. Punzalan
- Applicant: Zigmund Ramirez Camacho , Henry D. Bathan , Arnel Trasporto , Jeffrey D. Punzalan
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/82
Abstract:
An integrated circuit package system is provided forming a lead finger from a padless lead frame, forming a lead tip hole in the lead finger, mounting an integrated circuit die having a solder bump on the lead finger, and reflowing the solder bump on the lead tip hole of the lead finger.
Public/Granted literature
- US20070170559A1 INTEGRATED CIRCUIT PACKAGE SYSTEM Public/Granted day:2007-07-26
Information query
IPC分类:
