Invention Grant
US08120095B2 High-density, trench-based non-volatile random access SONOS memory SOC applications 有权
高密度,基于沟槽的非易失性随机存取SONOS存储器SOC应用

High-density, trench-based non-volatile random access SONOS memory SOC applications
Abstract:
The present invention provides two-transistor silicon-oxide-nitride-oxide-semiconductor (2-Tr SONOS) non-volatile memory cells with randomly accessible storage locations as well as a design structure including the semiconductor memory devices embodied in a machine readable medium. In one embodiment, a 2-Tr SONOS cell is provided in which the select transistor is located with a trench structure having trench depth from 1 to 2 μm and the memory transistor is located on a surface of a semiconductor substrate adjoining the trench structure. In another embodiment, a 2-Tr SONOS memory cell is provided in which both the select transistor and the memory transistor are located within a trench structure having the depth mentioned above.
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