Invention Grant
US08120095B2 High-density, trench-based non-volatile random access SONOS memory SOC applications
有权
高密度,基于沟槽的非易失性随机存取SONOS存储器SOC应用
- Patent Title: High-density, trench-based non-volatile random access SONOS memory SOC applications
- Patent Title (中): 高密度,基于沟槽的非易失性随机存取SONOS存储器SOC应用
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Application No.: US11955940Application Date: 2007-12-13
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Publication No.: US08120095B2Publication Date: 2012-02-21
- Inventor: Herbert L. Ho , Jack A. Mandelman , Tak H. Ning , Yoichi Otani
- Applicant: Herbert L. Ho , Jack A. Mandelman , Tak H. Ning , Yoichi Otani
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Joseph P. Abate, Esq.
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
The present invention provides two-transistor silicon-oxide-nitride-oxide-semiconductor (2-Tr SONOS) non-volatile memory cells with randomly accessible storage locations as well as a design structure including the semiconductor memory devices embodied in a machine readable medium. In one embodiment, a 2-Tr SONOS cell is provided in which the select transistor is located with a trench structure having trench depth from 1 to 2 μm and the memory transistor is located on a surface of a semiconductor substrate adjoining the trench structure. In another embodiment, a 2-Tr SONOS memory cell is provided in which both the select transistor and the memory transistor are located within a trench structure having the depth mentioned above.
Public/Granted literature
- US20090158226A1 HIGH-DENSITY, TRENCH-BASED NON-VOLATILE RANDOM ACCESS SONOS MEMORY CELLS FOR SOC APPLICATIONS Public/Granted day:2009-06-18
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