Invention Grant
- Patent Title: High-drive current MOSFET
- Patent Title (中): 高驱动电流MOSFET
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Application No.: US12607116Application Date: 2009-10-28
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Publication No.: US08120058B2Publication Date: 2012-02-21
- Inventor: Jae-Eun Park , Xinlin Wang , Xiangdong Chen
- Applicant: Jae-Eun Park , Xinlin Wang , Xiangdong Chen
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent H. Daniel Schnurmann
- Main IPC: H01L29/739
- IPC: H01L29/739

Abstract:
A method of forming a semiconductor device having an asymmetrical source and drain. In one embodiment, the method includes forming a gate structure on a first portion of the substrate having a well of a first conductivity. A source region of a second conductivity and drain region of the second conductivity is formed within the well of the first conductivity in a portion of the substrate that is adjacent to the first portion of the substrate on which the gate structure is present. A doped region of a second conductivity is formed within the drain region to provide an integrated bipolar transistor on a drain side of the semiconductor device, in which a collector is provided by the well of the first conductivity, the base is provided by the drain region of the second conductivity and the emitter is provided by the doped region of the second conductivity that is present in the drain region. A semiconductor device formed by the above-described method is also provided.
Public/Granted literature
- US20110095333A1 HIGH-DRIVE CURRENT MOSFET Public/Granted day:2011-04-28
Information query
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