Invention Grant
US08120040B2 Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
有权
用于安装IC芯片的基板，用于安装IC芯片的基板的制造方法，光通信装置以及用于光通信的装置的制造方法
- Patent Title: Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
- Patent Title (中): 用于安装IC芯片的基板，用于安装IC芯片的基板的制造方法，光通信装置以及用于光通信的装置的制造方法
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Application No.: US12785786Application Date: 2010-05-24
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Publication No.: US08120040B2Publication Date: 2012-02-21
- Inventor: Motoo Asai , Hiroaki Kodama , Toyoaki Tanaka
- Applicant: Motoo Asai , Hiroaki Kodama , Toyoaki Tanaka
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2002-099305 20020401; JP2002-099306 20020401; JP2002-099307 20020401
- Main IPC: H01L29/04
- IPC: H01L29/04
Abstract:
A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.
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