Invention Grant
- Patent Title: System for overlay measurement in semiconductor manufacturing
- Patent Title (中): 半导体制造中覆盖测量系统
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Application No.: US12537410Application Date: 2009-08-07
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Publication No.: US08119992B2Publication Date: 2012-02-21
- Inventor: Hsiao-Tzu Lu , Chin-Hsiang Lin , Hua-Shu Wu , Chia-Hsiang Lin , Kuei Shun Chen
- Applicant: Hsiao-Tzu Lu , Chin-Hsiang Lin , Hua-Shu Wu , Chia-Hsiang Lin , Kuei Shun Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G01J1/42
- IPC: G01J1/42 ; H01L23/544 ; H01L21/76
Abstract:
Provided is a system for overlay measurement in semiconductor manufacturing that includes a generator for exposing an overlay target to radiation and a detector for detecting reflected beams of the overlay target. The reflected beams are for overlay measurement and include at least two different beams.
Public/Granted literature
- US20090294685A1 SYSTEM FOR OVERLAY MEASUREMENT IN SEMICONDUCTOR MANUFACTURING Public/Granted day:2009-12-03
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