A land pattern, a method of manufacturing a printed circuit board (PCB) and a PCB incorporating a land pattern. In one embodiment, the land pattern includes: (1) a quadrilateral component outline area having diagonally opposed first and second corners and diagonally opposed third and fourth corners, defined according to a body configuration of a particular component type and located on a surface of a substrate and (2) first and second exposed conductive pads located within said area respectively proximate said first and second corners, coupled to respective first and second circuit conductors of said substrate, configured according to a terminal configuration of said type and separated from said third and fourth corners such that a component of said particular component type may be placed on the land pattern in multiple orientations without causing a short circuit.