Invention Grant
US08094458B2 Semiconductor package with embedded magnetic component and method of manufacture
有权
具有嵌入式磁性元件的半导体封装及其制造方法
- Patent Title: Semiconductor package with embedded magnetic component and method of manufacture
- Patent Title (中): 具有嵌入式磁性元件的半导体封装及其制造方法
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Application No.: US12383468Application Date: 2009-03-23
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Publication No.: US08094458B2Publication Date: 2012-01-10
- Inventor: Courtney R. Furnival
- Applicant: Courtney R. Furnival
- Applicant Address: US CA Aliso Viejo
- Assignee: Microsemi Corporation
- Current Assignee: Microsemi Corporation
- Current Assignee Address: US CA Aliso Viejo
- Agency: Holland & Hart LLP
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01F5/00

Abstract:
A printed circuit board (PCB) substrate which can be used in a semiconductor package, such as BGA and LGA, has a top surface and a bottom surface. A magnetic component includes a laterally extending bottom plate, two or more vertically extending posts, and a laterally extending top plate, wherein the bottom plate is fully embedded within the PCB substrate and the two or more posts extend in the PCB substrate from the bottom plate toward the upper surface of the PCB substrate. The top plate contacts an end of each of the two or more posts along the top surface of the PCB substrate.
Public/Granted literature
- US20090237899A1 Semiconductor package with embedded magnetic component and method of manufacture Public/Granted day:2009-09-24
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