Invention Grant
- Patent Title: Systems for thermal patterning
- Patent Title (中): 热图案化系统
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Application No.: US12506873Application Date: 2009-07-21
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Publication No.: US08094174B2Publication Date: 2012-01-10
- Inventor: Ying-Chi Chen , Chao-Hsu Tsai
- Applicant: Ying-Chi Chen , Chao-Hsu Tsai
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Priority: TW97138183A 20081003
- Main IPC: B41J25/308
- IPC: B41J25/308
Abstract:
Systems for thermal patterning are presented. The system includes a thermal print head module. The thermal print head module includes at least one point heater. An elastic adjustable device is used for adjusting the flatness of the thermal print head module. A rotation adjustable device is used for controlling the thermal print head module to rotate with a predetermined angle.
Public/Granted literature
- US20100085411A1 SYSTEMS FOR THERMAL PATTERNING Public/Granted day:2010-04-08
Information query
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