Invention Grant
- Patent Title: Semiconductor switching module optimized for resistance to short circuits
- Patent Title (中): 针对短路电阻优化的半导体开关模块
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Application No.: US11896561Application Date: 2007-09-04
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Publication No.: US08093975B2Publication Date: 2012-01-10
- Inventor: Markus Meier , Bertrand Viala , Stephan Jonas
- Applicant: Markus Meier , Bertrand Viala , Stephan Jonas
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: EP06018862 20060908
- Main IPC: H01H9/02
- IPC: H01H9/02 ; H02B1/00 ; H05K5/00
Abstract:
A semiconductor switching module including a housing having openings to remove pressure which occurs during a short circuit. The housing openings, which can be sealed by thin walls dimensioned so that so that parts which carry current cannot be touched from outside and the walls can be destroyed or removed by the pressure which occurs during a short circuit.
Public/Granted literature
- US20080061912A1 Semiconductor switching module optimized for resistance to short circuits Public/Granted day:2008-03-13
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